TK

Tea Hyuk Kang

LC Lg Innotek Co.: 1 patents #1,456 of 2,133Top 70%
📍 Seoul, KR: #24,369 of 39,741 inventorsTop 65%
Overall (All Time): #2,974,712 of 4,157,543Top 75%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9818714 Method of manufacturing substrate for chip packages and method of manufacturing chip package Hong-Il Kim 2017-11-14