Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369443 | Diode package structure and manufacturing method thereof | Hsiang-Chun Hsu, Cheng-Ping Chang | 2025-07-22 |
| 12040434 | Diode package structure and manufacturing method thereof | Hsiang-Chun Hsu, Cheng-Ping Chang | 2024-07-16 |