Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4943845 | Thick film packages with common wafer aperture placement | — | 1990-07-24 |
| 4379059 | Fabric softening composition and a process for preparing it from cationic surfactant and thickener | John A. Hockey, Malcolm Shaw, Allan A. Wilson | 1983-04-05 |