Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664297 | Manufacturing method for reflowed solder balls and their under bump metallurgy structure | — | 2023-05-30 |
| 11127658 | Manufacturing method for reflowed solder balls and their under bump metallurgy structure | — | 2021-09-21 |
| 10825788 | Method for manufacturing compliant bump | — | 2020-11-03 |