Hiroyuki NUMAGUCHI

LC Lapis Semiconductor Co.: 2 patents #112 of 349Top 35%

📍 Miyazaki, JP: #172 of 531 inventorsTop 35%

Overall (All Time): #1,973,384 of 4,157,543Top 50%

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Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
9564401	Method for thinning, metalizing, and dicing a semiconductor wafer, and semiconductor device made using the method	—	2017-02-07
8945988	Method for thinning, metalizing, and dicing a semiconductor wafer and, semiconductor device made using the method	—	2015-02-03