Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5658425 | Method of etching contact openings with reduced removal rate of underlying electrically conductive titanium silicide layer | Mark Halman, David Kerr | 1997-08-19 |
| 5269879 | Method of etching vias without sputtering of underlying electrically conductive layer | Mark Halman, David Kerr | 1993-12-14 |