Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5051375 | Method of producing semiconductor wafer through gettering using spherical abrasives | Sueo Sakata, Yasunori Oka | 1991-09-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5051375 | Method of producing semiconductor wafer through gettering using spherical abrasives | Sueo Sakata, Yasunori Oka | 1991-09-24 |