Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12177983 | Electronic component housing package, electronic device, and electronic module | Keisuke Sawada | 2024-12-24 |
| 12009285 | Substrate having a recessed portion for an electronic component | Tomoyuki Iwata | 2024-06-11 |
| 11264967 | Multi-piece wiring substrate, electronic component housing package, electronic device, and electronic module | — | 2022-03-01 |
| 10991671 | Multi-piece wiring substrate, electronic component housing package, and electronic device | — | 2021-04-27 |
| 10945338 | Wiring substrate | — | 2021-03-09 |
| 10499510 | Multi-piece wiring substrate, wiring substrate, and method for manufacturing multi-piece wiring substrate | — | 2019-12-03 |
| 10182508 | Electronic component housing package, multi-piece wiring substrate, and method for manufacturing electronic component housing package | Shuichi Kawasaki | 2019-01-15 |