Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293963 | Wiring substrate and electronic device | Tomoya KON | 2025-05-06 |
| 12273990 | High-frequency board, high-frequency package, and high-frequency module | — | 2025-04-08 |
| 11758648 | High-frequency board, high-frequency package, and high-frequency module | — | 2023-09-12 |
| 11102880 | High-frequency board, high-frequency package, and high-frequency module | — | 2021-08-24 |
| 10869387 | High-frequency board, high-frequency package, and high-frequency module | — | 2020-12-15 |
| 10068818 | Semiconductor element package, semiconductor device, and mounting structure | — | 2018-09-04 |
| 10051725 | Circuit board, electronic component housing package, and electronic device | — | 2018-08-14 |
| 10014233 | Electronic component containing package and electronic device | — | 2018-07-03 |
| 9935025 | Electronic component housing package and electronic device | — | 2018-04-03 |
| 9922925 | Electronic component housing package, and electronic device comprising same | — | 2018-03-20 |
| 9805995 | Element-accommodating package and mounting structure | — | 2017-10-31 |
| 9462709 | Element housing package and mounting structure body | — | 2016-10-04 |
| 9386687 | Electronic component housing package and electronic apparatus | Mahiro Tsujino | 2016-07-05 |