Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5767564 | Semiconductor device with a decoupling capacitor mounted thereon having a thermal expansion coefficient matched to the device | Yasuyoshi Kunimatsu, Akira Furuzawa | 1998-06-16 |
| 5547908 | Dielectric ceramic composition and package made of the same composition for packaging semiconductor | Akira Furuzawa, Takeshi Kubota, Kunihide Shikata | 1996-08-20 |