Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424053 | Ceramic feedthrough assemblies for electronic devices with metal housings | Franklin Kim, Hiroshi Makino, Shinichi Hira | 2022-08-23 |
| 10410959 | Lead package and method for minimizing deflection in microelectronic packaging | Franklin Kim, Shinichi Hira | 2019-09-10 |
| 9859185 | Semiconductor packaging structure and package having stress release structure | Satoru Tomie, Eiji Watanabe, Eiji Tanaka | 2018-01-02 |
| 9331000 | Heat management in electronics packaging | Franklin Kim, Chong Il-Park, Shinichi Hira | 2016-05-03 |