Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441697 | Ultra-low-loss feedthrough for microwave circuit package | Paul Garland, James Kyo Long, Yozo Satoda | 2002-08-27 |
| 6204448 | High frequency microwave packaging having a dielectric gap | Paul Garland, James Kyo Long, Yozo Satoda | 2001-03-20 |
| 5160747 | Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuit package | Takayasu Kizaki, Reiichi Yamada | 1992-11-03 |
| 5137767 | Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuit | Nobuaki Miyauchi, Hiroshi Yonemasu, Bakji Cho | 1992-08-11 |
| 5095360 | Ceramic chip-resistant chamfered integrated circuit package | Takayasu Kizaki, Reiichi Yamada | 1992-03-10 |