Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10541223 | Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines | Wong Hing Kuong, Peter Peh, Liu Yang, Kamal Kant Gupta | 2020-01-21 |
| 8360304 | Method of operating a clamping system of a wire bonding machine | Sung Sig Kang, Hing Kuong Wong, Abdul Shukor Mohd Salleh, Wun Man Oranna Yauw | 2013-01-29 |