Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10648140 | Bridge laying device for laying a bridge, in particular a single-piece bridge | Uwe Beitz, Markus Raff | 2020-05-12 |
| 8282761 | Method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers | Hans Oelkrug, Josef Schuster | 2012-10-09 |
| 6045436 | Process for the material-abrading machining of the edge of a semiconductor wafer | Simon Ehrenschwendtner | 2000-04-04 |