Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11866623 | Conductive polymer composite for adhesion to flexible substrate and method for preparing same | Heesuk Kim, Min Park, Sang Soo Lee, Jeong Gon Son, Jong Hyuk Park +2 more | 2024-01-09 |
| 11787966 | Paste manufacturing method and flexible electrode manufacturing method using the same | Seungjun Chung, Byeongmoon Lee, Hyunjoo Cho, Heesuk Kim, Phillip Lee +2 more | 2023-10-17 |
| 11299655 | Highly-dielectric, elastic structure and a touch sensor including the same | Heesuk Kim, Min Park, Sang Soo Lee, Jeong Gon Son, Jong Hyuk Park +2 more | 2022-04-12 |