Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6197139 | Method for electrostatic thermal bonding of a pair of glass substrates by utilizing a silicon thin film | Byeong Kwon Ju, Myung Hwan Oh | 2001-03-06 |
| 6007397 | Vacuum packaging apparatus for a field emission display and a method thereof using a glass-to-glass bonding | Byeong Kwon Ju, Myung Hwan Oh | 1999-12-28 |