Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8486827 | Device of filling metal in through-via-hole of semiconductor wafer and method using the same | Se Hoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Cheol-Hee Kim +1 more | 2013-07-16 |