Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115635 | Method for filling a wafer via with solder | Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko | 2018-10-30 |
| 9603254 | Apparatus for filling a wafer via with solder | Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Young Ki Ko | 2017-03-21 |
| 7303723 | Method of forming nanostructures on ceramics | Sheikh A. Akbar, Kenneth H. Sandhage | 2007-12-04 |