Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5109067 | Process for the preparation of the modified resin and epoxy resin composition containing the modified resin for use in semiconductor encapsulation | Lee J. Dae, Yoo C. Joon | 1992-04-28 |