Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12428704 | Nickel-based superalloy for diffusion bonding and method for diffusion bonding using the same | In Jin SAH, Eung Seon Kim, Min Hwan Kim | 2025-09-30 |
| 6679970 | Structure for preventing the embezzlement and the see-through of the prepayment card | — | 2004-01-20 |