Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11394098 | Waveguide including a first dielectric part covered in part by a conductive part and a second dielectric part surrounding the first dielectric part and the conductive part | Hyeon Min Bae | 2022-07-19 |
| 11394099 | Connector for connecting a waveguide to a board and having a first opening part facing the board and a second opening part for receiving the waveguide | Hyeon Min Bae | 2022-07-19 |
| 11289788 | Board-to-board interconnect apparatus including microstrip circuits connected by a waveguide, wherein a bandwidth of a frequency band is adjustable | Hyeon Min Bae, Huxian Jin | 2022-03-29 |
| 10777865 | Chip-to-chip interface comprising a waveguide with a dielectric part and a conductive part, where the dielectric part transmits signals in a first frequency band and the conductive part transmits signals in a second frequency band | Hyeon Min Bae, Joon Yeong Lee, Tae-Hoon Yoon, Hyo Sup Won | 2020-09-15 |
| 10777868 | Waveguide comprising first and second dielectric parts, where the first dielectric part comprises two or more separate dielectric parts | Hyeon Min Bae, Joon Yeong Lee, Tae-Hoon Yoon, Hyo Sup Won | 2020-09-15 |
| 10770774 | Microstrip-waveguide transition for transmitting electromagnetic wave signal | Hyeon Min Bae, Joon Yeong Lee, Tae-Hoon Yoon, Hyo Sup Won | 2020-09-08 |
| 10686241 | Board-to-board interconnect apparatus including a microstrip circuit connected by a waveguide, where a bandwidth of a frequency band is adjustable | Hyeon Min Bae, Huxian Jin | 2020-06-16 |
| 9093732 | Low power, high speed multi-channel chip-to-chip interface using dielectric waveguide | Hyeon Min Bae, Huxian Jin | 2015-07-28 |