Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9764430 | Lead-free solder alloy, solder material and joined structure | Rie Wada | 2017-09-19 |
| 9421646 | Soldering paste and flux | Masashi Kashiwabara, Kenji Kondo, Masahito Hidaka | 2016-08-23 |