Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11279852 | CMP slurry compositions and methods of fabricating a semiconductor device using the same | Eunsung Seo, Sung Pyo LEE, Dongchan Kim, Bo Yun Kim, Jun Ha HWANG | 2022-03-22 |
| 10494547 | Additive composition and positive polishing slurry composition including the same | Jang Kuk KWON, Sung Pyo LEE, Jun Ha HWANG | 2019-12-03 |
| 10435587 | Polishing compositions and methods of manufacturing semiconductor devices using the same | Seung Ho Park, Ki Hwa Jung, Sang Kyun Kim, Jun Ha HWANG, Seung Yeop Baek +4 more | 2019-10-08 |
| 10421883 | Abrasive particle-dispersion layer composite and polishing slurry composition including the same | Jang Kuk KWON, Sung Pyo LEE, Jun Ha HWANG | 2019-09-24 |
| 10138395 | Abrasive particle-dispersion layer composite and polishing slurry composition including the same | Jang Kuk KWON, Sung Pyo LEE, Jun Ha HWANG | 2018-11-27 |