Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6166131 | Highly reactive modified phenolic resin and molding material for electrical/electronic parts and semiconductor sealing material | Masao Tashima, Hiromi Miyasita, Tomoaki Fujii, Tatsushi Ishizuka, Makoto Hasegawa | 2000-12-26 |
| 6034210 | Process for producing highly reactive modified phenolic resin and molding material | Masao Tashima, Hiromi Miyasita, Tomoaki Fujii, Tatsushi Ishizuka, Makoto Hasegawa | 2000-03-07 |
| 5484854 | Modified phenolic resin, epoxy resin and curing agent molding material | Masahiro Tsumura, Masao Tashima, Hiromi Miyasita, Tomoaki Fujii | 1996-01-16 |
| 5432240 | Modified phenolic resin from formaldehyde polymer, phenol and oil or pitch | Masahiro Tsumura, Masao Tashima, Hiromi Miyasita, Tomoaki Fujii | 1995-07-11 |