Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12410280 | Synthesis, purification, and properties of ring-opened benzoxazine thermoplastic | Tianlei Zhou, Haiqing YAO | 2025-09-09 |
| 12077644 | Amide acid oligomer process for molding polyimide composites | — | 2024-09-03 |
| 10815390 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | Yuichi Ishida, Toshio Ogasawara, Rikio Yokota | 2020-10-27 |
| 10526450 | Terminally modified imide oligomer, varnish, cured products thereof, film, and imide prepreg and fiber-reinforced composite material using these | Takefumi Furuta, Rikio Yokota, Yuichi Ishida | 2020-01-07 |
| 10047246 | Varnish including 2-phenyl-4,4′-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechanical strength | Yuichi Ishida, Toshio Ogasawara, Rikio Yokota | 2018-08-14 |
| 10017666 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | Yuichi Ishida, Toshio Ogasawara, Rikio Yokota | 2018-07-10 |
| 9051430 | Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4′diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance | Yuichi Ishida, Toshio Ogasawara, Rikio Yokota | 2015-06-09 |
| 8846552 | Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance | Yuichi Ishida, Toshio Ogasawara, Rikio Yokota | 2014-09-30 |
| 7745914 | Package for receiving electronic parts, and electronic device and mounting structure thereof | — | 2010-06-29 |
| 6921971 | Heat releasing member, package for accommodating semiconductor element and semiconductor device | Yoshihiro Basho, Ryuji Mori | 2005-07-26 |