Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8501874 | Thermosetting resin composition, multilayer body using same, and circuit board | Shigeru Tanaka, Takashi Itoh, Koji Okada, Mutsuaki Murakami | 2013-08-06 |
| 8067523 | Thermosetting resin composition, laminated body using it, and circuit board | Shigeru Tanaka, Takashi Ito, Mutsuaki Murakami | 2011-11-29 |
| 7521511 | Thermosetting resin composition, multilayer body using same, and circuit board | Shigeru Tanaka, Takashi Itoh, Koji Okada, Mutsuaki Murakami | 2009-04-21 |