HN

Hirosaku Nagano

KK Kanegafuchi Kagaku Kogyo: 13 patents #19 of 691Top 3%
KA Kaneka: 3 patents #437 of 1,525Top 30%
SC Sanyo Electric Co.: 1 patents #3,644 of 6,347Top 60%
Overall (All Time): #225,754 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
7252881 Multilayer structure and multilayer wiring board using the same Takashi Itoh, Shoji Hara, Masaru Nishinaka 2007-08-07
7011905 Solid polymer electrolyte membrane, solid polymer electrolyte fuel cell using the membrane and method of fabricating the same Shigeru Sakamoto, Hiroko Sanda, Hidekazu Kuromatsu, Kiyoyuki Namura 2006-03-14
6773809 Copper foil with insulating adhesive Takashi Itoh, Shoji Hara 2004-08-10
5932345 Thermally fusible adhesive copolymer, articles made therefrom, and method for producing the same Hiroyuki Furutani, Naoki Hase, Junya Ida, Yoshifumi Okamoto, Hitoshi Nojiri +1 more 1999-08-03
5861192 Method of improving adhesive property of polyimide film and polymidefilm having improved adhesive property Masao Nakata, Kosuke Kataoka 1999-01-19
5759693 Laminate Hiroyuki Tsuji, Shoji Hara 1998-06-02
5668247 Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires Hiroyuki Furutani, Kazuhisa Danno, Yoshifumi Okamoto, Junya Ida, Yoshihide Oonari +1 more 1997-09-16
5665802 Polyimide film and manufacturing method thereof Haruhiko Maki, Yoshiaki Inaba 1997-09-09
5641852 Thermosetting resin composition and method of manufacturing it from an epoxy resin, cyanate and phenol Hiroyuki Tsuji, Shoji Hara 1997-06-24
5621068 Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate Yoshifumi Okamoto, Hiroyuki Furutani, Kazuhisa Danno, Junya Ida 1997-04-15
5167985 Process for producing flexible printed circuit board Hiroshi Ito, Hiroyuki Furutani, Hitoshi Nojiri 1992-12-01
5081229 Polyimide having excellent thermal dimensional stability Kiyokazu Akahori, Hideki Kawai 1992-01-14
5070181 Polyimide film Hideki Kawai, Kiyokazu Akahori 1991-12-03
5066770 Process and apparatus for manufacturing polymers Takehiko Noguchi, Takashi Sakubata 1991-11-19
5026820 Process for continuous mixing of a two-liquid curing type resin Takehiko Noguchi, Takashi Sakubata, Akinori Hisanaga, Tetsuo Yoshioka 1991-06-25
4886874 Polyimide having excellent thermal dimensional stability Hideki Kawai, Kiyokazu Akahori 1989-12-12
4742099 Polyimide film and process for producing same Junji Takase, Hideki Kawai, Hitoshi Nojiri, Tsuneo Yamamoto 1988-05-03
4451621 Heat resistant resin composition comprising modified polyamide-imide resin having carboxyl groups Kazuya Yonezawa, Kazuaki Kira, Hiroshi Wakabayashi 1984-05-29
4387192 Heat resistant polyamide-imide resin from polycarboxylic acid-polyisocyanate modified with unsaturated monomer Kazuya Yonezawa, Kazuaki Kira, Hiroshi Wakabayashi 1983-06-07
4362826 Heat-resistant resin composition Kazuya Yonezawa 1982-12-07