Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293957 | Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels | Kambiz Vafai | 2025-05-06 |
| 12087663 | Optimization of the thermal performance of the 3D ICs utilizing the integrated chip-size double-layer or multi-layer microchannels | Kambiz Vafai | 2024-09-10 |