Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892389 | Packaging leadframe and packaging structure | — | 2021-01-12 |
| 10566510 | Packaging frame and manufacturing method of packaging frame | — | 2020-02-18 |
| 10276753 | LED flip-chip package substrate and LED package structure | Steve Meng-Yuan Hong | 2019-04-30 |