Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10172241 | Method for packaging flexible device using holding wafer, and flexible device manufactured by the same | Kyung Wook Baek, Keon Jae Lee, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim | 2019-01-01 |
| 9113586 | Device for bonding flexible PCB to camera module | Jae Chun Lee, Kyuong-wook Paik, Kiwon Lee | 2015-08-18 |