Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12339313 | Electrical testing method for semiconductor device | — | 2025-06-24 |
| 11602875 | Injection molding apparatus and injection molding method | Hitoshi Tsujikawa, Kyota Imai | 2023-03-14 |
| 11285449 | Method for producing sealant | Shigemi Yamane, Hitoshi Tsujikawa | 2022-03-29 |
| 10507487 | Cartridge for viscous-material dispenser | Hitoshi Tsujikawa, Kyota Imai, Akira Kanazawa | 2019-12-17 |
| 10493668 | Molding method and mold therefor | Takayuki Nomura, Hitoshi Tsujikawa, Yoshiki Ikeda | 2019-12-03 |
| 10479587 | Cartridge for viscous-material dispenser | Hitoshi Tsujikawa, Kyota Imai, Akira Kanazawa | 2019-11-19 |
| 10336478 | Viscous-material filling method | Hitoshi Tsujikawa | 2019-07-02 |
| 10293361 | Cartridge for viscous-material dispenser | Hitoshi Tsujikawa, Kyota Imai, Akira Kanazawa | 2019-05-21 |
| 10189189 | Molding method and mold therefor | Takayuki Nomura, Hitoshi Tsujikawa, Yoshiki Ikeda | 2019-01-29 |
| 9731846 | Viscous-material filling method | Hitoshi Tsujikawa | 2017-08-15 |
| 9598223 | Plunger for pneumatic dispenser | Hitoshi Tsujikawa, Kyota Imai | 2017-03-21 |
| 9340306 | Viscous-material filling apparatus | Hitoshi Tsujikawa | 2016-05-17 |
| 9186823 | Molding method and mold therefor | Takayuki Nomura, Hitoshi Tsujikawa, Yoshiki Ikeda | 2015-11-17 |
| 9126702 | Viscous-material filling method | Hitoshi Tsujikawa | 2015-09-08 |
| 8617453 | Molding method and mold therefor | Takayuki Nomura, Hitoshi Tsujikawa, Yoshiki Ikeda | 2013-12-31 |
| 8114687 | Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device | — | 2012-02-14 |
| 7868469 | Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device | — | 2011-01-11 |
| 7825410 | Semiconductor device | — | 2010-11-02 |
| 7713764 | Method for manufacturing semiconductor device including testing dedicated pad and probe card testing | — | 2010-05-11 |