TM

Takashi Murase

TI Toyota Industries: 9 patents #179 of 1,610Top 15%
UA Uacj: 8 patents #18 of 238Top 8%
FC Furukawa Electric Co.: 4 patents #473 of 2,370Top 20%
NC Nemoto & Co.: 3 patents #4 of 27Top 15%
HM Hitachi Medical: 2 patents #260 of 680Top 40%
FC Fuji Electric Co.: 1 patents #1,354 of 2,643Top 55%
FA Furukawa-Sky Aluminum: 1 patents #24 of 80Top 30%
DE Denso: 1 patents #6,940 of 11,792Top 60%
CR Cryodevice: 1 patents #3 of 9Top 35%
Overall (All Time): #137,836 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 26–28 of 28 patents

Patent #TitleCo-InventorsDate
5084966 Method of manufacturing heat pipe semiconductor cooling apparatus 1992-02-04
4982274 Heat pipe type cooling apparatus for semiconductor Suemi Tanaka 1991-01-01
4675783 Heat pipe heat sink for semiconductor devices Tatsuya Koizumi 1987-06-23