YO

Yutaka Onozuka

KT Kabushiki Kaisha Toshiba: 37 patents #580 of 21,451Top 3%
Overall (All Time): #90,168 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 1–25 of 37 patents

Patent #TitleCo-InventorsDate
10646899 Cell sorter Kaita Imai, Shouhei Kousai, Yosuke Akimoto, Michihiko Nishigaki, Miyu Nagai 2020-05-12
10379440 Pattern forming method, semiconductor device, and manufacturing method thereof Michihiko Nishigaki, Shouhei Kousai, Yosuke Akimoto, Miyu Nagai, Kaita Imai 2019-08-13
10337994 Sample liquid measuring device and measuring method Kaita Imai, Shouhei Kousai, Yosuke Akimoto, Michihiko Nishigaki, Miyu Nagai 2019-07-02
10337976 Microanalysis chip Michihiko Nishigaki, Kentaro Kobayashi, Hiroshi Hamasaki, Naofumi Nakamura 2019-07-02
10126168 Optical sensor Yosuke Akimoto, Shouhei Kousai, Kaita Imai, Michihiko Nishigaki, Miyu Nagai 2018-11-13
9913367 Wiring board and method of manufacturing the same Nobuto Managaki, Tadahiro Sasaki, Atsuko Iida, Hiroshi Yamada 2018-03-06
9895691 Analysis package for detecting particles in a sample liquid Hiroshi Hamasaki, Michihiko Nishigaki, Kentaro Kobayashi, Hiroko MIKI, Naofumi Nakamura 2018-02-20
9885680 Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board Hiroshi Hamasaki, Michihiko Nishigaki, Kentaro Kobayashi, Hiroko MIKI, Naofumi Nakamura 2018-02-06
9770714 Analysis package for detecting particles in a sample liquid, and including shield layers Hiroshi Hamasaki, Michihiko Nishigaki, Kentaro Kobayashi, Hiroko MIKI, Naofumi Nakamura 2017-09-26
9698482 Antenna device Tadahiro Sasaki, Kazuhiko Itaya, Hiroshi Yamada, Nobuto Managaki, Atsuko Iida 2017-07-04
9548279 Connection member, semiconductor device, and stacked structure Atsuko Iida, Tadahiro Sasaki, Nobuto Managaki, Hiroshi Yamada 2017-01-17
9502367 Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap Hiroshi Yamada, Nobuto Managaki, Tadahiro Sasaki 2016-11-22
9490237 Semiconductor package including a plurality of chips Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya 2016-11-08
9397057 Plurality of semiconductor devices in resin with a via Hiroshi Yamada, Nobuto Managaki 2016-07-19
8980697 Method of fabricating chip scale package Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya 2015-03-17
8951905 Semiconductor device and production method thereof Hiroshi Yamada, Kazuhiko Itaya 2015-02-10
8008760 Integrated semiconductor device Hiroshi Yamada, Kazuhiko Itaya, Hideyuki Funaki 2011-08-30
7906823 MEMS apparatus and method of manufacturing the same Kazuhiro Suzuki, Michihiko Nishigaki, Hiroshi Yamada, Kazuhiko Itaya, Hideyuki Funaki 2011-03-15
7893525 Semiconductor device having an adhesive portion with a stacked structure and method for manufacturing the same Atsuko Iida, Kazuhiko Itaya 2011-02-22
7875481 Semiconductor apparatus and method for manufacturing the same Hiroshi Yamada, Hideyuki Funaki, Kazuhiko Itaya 2011-01-25
7863617 Active matrix type display device and method of manufacturing the same Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara 2011-01-04
7763957 Active matrix type display device and method of manufacturing the same Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara 2010-07-27
7612438 Active matrix substrate with height control member Masahiko Akiyama, Yujiro Hara, Tsuyoshi Hioki, Mitsuo Nakajima 2009-11-03
7541224 Active matrix type display device and method of manufacturing the same Tsuyoshi Hioki, Masahiko Akiyama, Mitsuo Nakajima, Yujiro Hara 2009-06-02
7407839 Method of manufacturing active matrix substrate with height control member Masahiko Akiyama, Yujiro Hara, Tsuyoshi Hioki, Mitsuo Nakajima 2008-08-05