Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D459705 | Semiconductor package | Nobuyuki Yokote | 2002-07-02 |
| 5376815 | Semiconductor device having bipolar-mos composite element pellet suitable for pressure contacted structure | Mitsuhiko Kitagawa, Dai Karasawa | 1994-12-27 |
| 5223442 | Method of making a semiconductor device of a high withstand voltage | Mitsuhiko Kitagawa, Kazuo Watanuki, Yoshinari Uetake, Kazunobu Nishitani, Tsuneo Ogura | 1993-06-29 |
| 5210601 | Compression contacted semiconductor device and method for making of the same | Mitsuhiko Kitagawa, Kazuo Watanuki | 1993-05-11 |
| 5156981 | Method of making a semiconductor device of a high withstand voltage | Mitsuhiko Kitagawa, Kazuo Watanuki, Yoshinari Uetake, Kazunobu Nishitani, Tsuneo Ogura | 1992-10-20 |
| 5028974 | Semiconductor switching device with anode shortening structure | Mituhiko Kitagawa, Tsuneo Ogura, Hiromichi Ohashi, Yoshinari Uetake, Kazuo Watanuki | 1991-07-02 |
| 4996586 | Crimp-type semiconductor device having non-alloy structure | Hideo Matsuda, Takashi Fujiwara, Mitsuhiko Kitagawa, Masami Iwasaki, Kazuo Watanuki | 1991-02-26 |