Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5218231 | Mold-type semiconductor device | — | 1993-06-08 |
| 5031024 | Resin sealing type semiconductor device having outer leads designed for multi-functions | Shinjiro Kojima | 1991-07-09 |