Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006029 | Method for manufacturing semiconductor devices | Yukio Katamura, Atsushi Yoshimura, Fumihiro Iwami | 2015-04-14 |
| 8772176 | Method for forming an adhesive layer and adhesive composition | Kazuyoshi Sakurai, Yuichi Noguchi, Norio Kurokawa | 2014-07-08 |
| 8691628 | Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus | Yukio Katamura, Atsushi Yoshimura, Fumihiro Iwami | 2014-04-08 |
| 8629041 | Method for manufacturing semiconductor device | Yukio Katamura, Atsushi Yoshimura, Fumihiro Iwami, Kazuyoshi Sakurai | 2014-01-14 |
| 8276537 | Method for manufacturing semiconductor device and semiconductor manufacturing apparatus | Yukio Katamura, Atsushi Yoshimura, Fumihiro Iwami | 2012-10-02 |
| 6208019 | Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein | Kazuyasu Tanaka | 2001-03-27 |
| 5528077 | Flexible tab semiconductor device | Jiro Nakano, Jun Ohno | 1996-06-18 |
| 5442241 | Bump electrode structure to be coupled to lead wire in semiconductor device | — | 1995-08-15 |