Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8673690 | Method for manufacturing a semiconductor device and a semiconductor device | — | 2014-03-18 |
| 7138297 | Method of dividing a semiconductor wafer utilizing a laser dicing technique | Ninao Sato | 2006-11-21 |
| 7091624 | Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same | Ninao Sato | 2006-08-15 |
| 6713869 | Wiring pattern of semiconductor device | Takeshi Kusakabe | 2004-03-30 |
| D473198 | Semiconductor device | Isao Ozawa | 2003-04-15 |
| 6429372 | Semiconductor device of surface mounting type and method for fabricating the same | Hideo Taguchi, Junichi Asada, Jun Omori, Toshikazu Mino, Naohisa Okumura +2 more | 2002-08-06 |