Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12240218 | Bonded assembly, and ceramic circuit substrate and semiconductor device using the same | Shota YAMAMOTO, Fumihiko Yoshimura, Seiichi Suenaga | 2025-03-04 |
| 10674603 | Ceramic circuit board and semiconductor device using the same | Hiroyasu Kondo | 2020-06-02 |