Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5556814 | Method of forming wirings for integrated circuits by electroplating | Misao Yoshimura | 1996-09-17 |
| 5273937 | Metal semiconductor device and method for producing the same | Kazuya Nishihori, Kenichi Tomita, Hitoshi Mikami, Masami Nagaoka, Naotaka Uchitomi | 1993-12-28 |
| 5148260 | Semiconductor device having an improved air-bridge lead structure | Toshiyuki Terada, Kenichi Tomita | 1992-09-15 |
| 5034799 | Semiconductor integrated circuit device having a hollow multi-layered lead structure | Kenichi Tomita, Toshiyuki Terada | 1991-07-23 |