Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784165 | Semiconductor device and dicing method | Kazuo Fujimura, Yoshiharu Takada, Ichiro Mizushima | 2020-09-22 |
| 9966311 | Semiconductor device manufacturing method | — | 2018-05-08 |
| 9953894 | Semiconductor device and manufacturing method thereof | Yoshiharu Takada, Kazuo Fujimura | 2018-04-24 |
| 9472467 | Manufacturing method of semiconductor device | — | 2016-10-18 |
| 9412825 | Semiconductor device | Takaaki Yasumoto, Naoko Yanase, Kazuhide Abe, Takeshi Uchihara, Yasunobu Saito +11 more | 2016-08-09 |
| 9054171 | HEMT semiconductor device | Tetsuya Ohno, Yasunobu Saito, Hidetoshi Fujimoto, Akira Yoshioka, Takeshi Uchihara +4 more | 2015-06-09 |
| 8916881 | Semiconductor device and method for manufacturing semiconductor device | Naoko Yanase, Takaaki Yasumoto, Ryoichi Ohara, Yorito Kakiuchi, Takao Noda +1 more | 2014-12-23 |
| 8558244 | Semiconductor device and method for manufacturing semiconductor device | Naoko Yanase, Takaaki Yasumoto, Ryoichi Ohara, Yorito Kakiuchi, Takao Noda +1 more | 2013-10-15 |
| 7528522 | Surface acoustic wave device, package for the device, and method of fabricating the device | Naoyuki Mishima | 2009-05-05 |
| 7304417 | Package for electronic device, base substrate, electronic device and fabrication method thereof | Osamu Kawachi, Takumi Kooriike | 2007-12-04 |
| 7215065 | Surface acoustic wave device, package for the device, and method of fabricating the device | Naoyuki Mishima, Masao Irikura | 2007-05-08 |
| 7200924 | Method of packaging electronic parts | — | 2007-04-10 |
| 7180228 | Surface acoustic wave device, package for the device, and method of fabricating the device | Naoyuki Mishima, Masao Irikura | 2007-02-20 |