Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4962056 | Method of manufacturing from a semiconductor wafer a dielectric substrate including mutually insulated and separated island regions, and a method of manufacturing semiconductor elements from the dielectric substrate | Bunshiro Yamaki | 1990-10-09 |
| 4888304 | Method of manufacturing an soi-type semiconductor device | Kaoru Nakagawa, Yoshio Yamamoto | 1989-12-19 |