NK

Naoyuki Komuta

KT Kabushiki Kaisha Toshiba: 9 patents #3,402 of 21,451Top 20%
Toshiba Memory: 6 patents #309 of 1,971Top 20%
📍 Ooita, JP: #28 of 516 inventorsTop 6%
Overall (All Time): #317,667 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
10903200 Semiconductor device manufacturing method Yuji Karakane, Masatoshi Fukuda, Soichi Homma, Yukifumi Oyama 2021-01-26
10854576 Semiconductor device and manufacturing method thereof Yuji Karakane, Masatoshi Fukuda, Soichi Homma, Masayuki Miura, Yuka Akahane +1 more 2020-12-01
10600773 Semiconductor device manufacturing method Yuji Karakane, Masatoshi Fukuda, Soichi Homma, Yukifumi Oyama 2020-03-24
10217676 Method and apparatus for manufacturing a semiconductor device including a plurality of semiconductor chips connected with bumps Shinya FUKAYAMA, Hiroshi Watabe 2019-02-26
10090273 Apparatus and method for manufacturing semiconductor device 2018-10-02
9960143 Method for manufacturing electronic component and manufacturing apparatus of electronic component Soichi Homma 2018-05-01
9449949 Method for manufacturing semiconductor device and semiconductor device 2016-09-20
9224713 Semiconductor device and manufacturing method thereof Satoshi Tsukiyama, Masatoshi Fukuda, Hiroshi Watabe, Keita Mizoguchi 2015-12-29
9052187 Inspection apparatus and inspection method for semiconductor device Masatoshi Fukuda 2015-06-09
9024424 Stacked electronic component and manufacturing method thereof Atsushi Yoshimura, Hideo Numata 2015-05-05
8710654 Semiconductor device and manufacturing method thereof Satoshi Tsukiyama, Masatoshi Fukuda, Hiroshi Watabe, Keita Mizoguchi 2014-04-29
8268673 Stacked electronic component and manufacturing method thereof Atsushi Yoshimura, Hideo Numata 2012-09-18
8191758 Method for manufacturing semiconductor device Kanako Sawada, Hideo Aoki, Koji Ogiso 2012-06-05
8008763 Stacked electronic component and manufacturing method thereof Atsushi Yoshimura, Hideo Numata 2011-08-30
7629695 Stacked electronic component and manufacturing method thereof Atsushi Yoshimura, Hideo Numata 2009-12-08