Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5143865 | Metal bump type semiconductor device and method for manufacturing the same | Makoto Hideshima, Tetsujiro Tsunoda, Shinjiro Kojima | 1992-09-01 |
| 5110314 | Device for inclining the tip path plane of a propeller of toy helicopter | Yuji Fujihara | 1992-05-05 |
| 5035849 | Process for producing molded article using a releasing agent | Katsuoki Uemura, Jun Yamauchi, Yoshinori Akutsu | 1991-07-30 |
| 4918514 | Press-contact type semiconductor device | Hideo Matsuda, Yasunori Usui, Shinjiro Kojima | 1990-04-17 |