Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7750473 | LSI wiring pattern for reduced deformation and cracking | Takamasa Usui, Hideki Shibata, Tadashi Murofushi, Hiroshi Hirayama | 2010-07-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7750473 | LSI wiring pattern for reduced deformation and cracking | Takamasa Usui, Hideki Shibata, Tadashi Murofushi, Hiroshi Hirayama | 2010-07-06 |