Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129277 | Method of machining wafer | Yusuke Kimura | 2012-03-06 |
| 5741410 | Apparatus for forming spherical electrodes | — | 1998-04-21 |
| 5467803 | Outer lead bending apparatus for a semiconductor package device having a package and outer leads extending from the package | Atsushi Yoshimura, Hiroshi Shibata, Fumio Takahashi | 1995-11-21 |
| 5417830 | Injection plating apparatus | — | 1995-05-23 |