Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5581443 | Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure | Hiroshi Nakamura, Kentaro Tomioka, Hideki Ogawa, Yuji Nakajima | 1996-12-03 |