AM

Akira Makabe

KT Kabushiki Kaisha Toshiba: 3 patents #8,011 of 21,451Top 40%
SE Seiko Epson: 3 patents #3,864 of 7,774Top 50%
Overall (All Time): #870,846 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
7579692 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument Fumiaki Matsushima, Tsutomu Ota 2009-08-25
7355280 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument Fumiaki Matsushima, Tsutomu Ota 2008-04-08
7224003 Solid-state image pickup apparatus Nobuo Nakamura, Hisanori Ihara, Ikuko Inoue, Hidenori Shibata, Akiko Nomachi +8 more 2007-05-29
7042061 Solid-state image pickup apparatus Nobuo Nakamura, Hisanori Ihara, Ikuko Inoue, Hidenori Shibata, Akiko Nomachi +8 more 2006-05-09
6809020 Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device Kazunori Sakurai, Tsutomu Ota, Fumiaki Matsushima 2004-10-26
6690423 Solid-state image pickup apparatus Nobuo Nakamura, Hisanori Ihara, Ikuko Inoue, Hidenori Shibata, Akiko Nomachi +8 more 2004-02-10