Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5800888 | Heat bonded type vibration-damping resin for structural member vibration-damping structure | Hiromichi OKUMURA, Kenji Iwai, Toshimitsu Tanaka, Toshihiko Sasaki, Akio Sugimoto +4 more | 1998-09-01 |