Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6313064 | Alloy having antibacterial effect and sterilizing effect | Yoshinobu Tsuzaki, Sadako Yamada, Takenori Nakayama, Wataru Urushihara | 2001-11-06 |
| 6202703 | Corrosion resistant copper alloy tube and fin-tube heat exchanger | Taro Kuroda, Kenju Minamoto, Mitsuhiro Ohkubo, Ryoichi Ozaki, Akinori Tsuchiya | 2001-03-20 |
| 6136104 | Copper alloy for terminals and connectors and method for making same | Hirofumi Arai, Koya Nomura | 2000-10-24 |
| 5769129 | Cold-and hot-water supply copper-alloy pipe with inner-surface protective film, method for manufacturing same, and hot-water supply heat exchanger | Taro Kuroda, Kenju Minamoto | 1998-06-23 |
| 5527377 | Manufacturing method of metal or alloy | Yosuke Miwa, Junichi Ohsako, Isao Hosokawa, Syuhei Mori | 1996-06-18 |
| 4990309 | High strength copper-nickel-tin-zinc-aluminum alloy of excellent bending processability | Riichi Tsuno, Tatsuya KINOSHITA, Hitoshi Tanaka | 1991-02-05 |
| 4822562 | Copper alloy excellent in migration resistance | Isao Hosokawa | 1989-04-18 |
| 4732732 | Migration resistant phosphor bronze alloy | Yasuhiro Nakashima, Isao Hosokawa | 1988-03-22 |
| 4687633 | Lead material for ceramic package IC | Tateo Yuchi, Riichi Tsuno | 1987-08-18 |
| 4656003 | Copper alloy and production of the same | Yasuhiro Nakashima, Satoru Katayama, Takashi Matsui, Hidekazu Harada, Youji Yuki | 1987-04-07 |
| 4591484 | Lead materials for semiconductor devices | Takashi Matsui, Hidekazu Harada | 1986-05-27 |
| 4430298 | Copper alloys for electric and electronic devices and method for producing same | Takashi Matsui, Hidekazu Harada, Masumitsu Soeda, Shin Ishikawa, Hiroshi Murakado +4 more | 1984-02-07 |