Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9543201 | Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection | Kenzou Ookita, Isao Aritome, Keisuke Kuriyama, Kazuto Watanabe, Atsushi Kobayashi +1 more | 2017-01-10 |
| 8349207 | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device | Tomikazu Ueno, Michiaki Andou | 2013-01-08 |
| 8318582 | Method of forming a trench isolation | Seitarou Hattori, Manabu Sekiguchi, Terukazu Kokubo, Kentaro Tamaki, Tsuyoshi Furukawa +1 more | 2012-11-27 |